SiC-on-Diamond
Power Electronics
6x Smaller
Simplifying inverter architecture
The diamond wafer’s extreme properties of thermal conductivity and electrical insulation enable novel architectures that radically advance miniaturization, efficiency, and robustness.
Introducing
DF Perseus
Power Inverter
+ compact
+ lightweight
+ efficient
The next-level miniaturization in power electronics
Tesla
Power Inverter
power (KW):250
Sic chips: 48
Volume (L): 28
Density (kW/L): 9
DF Perseus
Power Inverter
power (KW):250
Sic chips: 18
Volume (L): 0.46
Density (kW/L): 500
Learn more about the innovations that have made this possible.
Partners
We are working with automotive leaders to shape the future.
Other industries accelerated by our wafer
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